Meeting the demands of consumers and packaging specialists
Today’s consumers want smaller devices, more functionality, outstanding reliability and, of course, lower cost. When it comes to semiconductor packaging, it’s possible to have it all with materials solutions from Henkel. As a pioneer in the semiconductor packaging market, Henkel has successfully enabled many of today’s leading consumer products.  

Serving a variety of markets and facilitating production of advanced devices, Henkel has a complete portfolio of die attach, underfill, encapsulant, mold compound and solder sphere products for nearly any package and any application, including:

• Logic/ASICs
• Flash/DRAM
• Photonics
• Discrete/Passives

For sophisticated stacked die applications, Ablestik die attach materials are the brand packaging professionals trust. With a proven track record of performance, reliability and processability, Ablestik die attach pastes, films, self-filleting and wafer backside coating materials enable today’s ultra-thin die stacking processes effectively and cost-efficiently.

When it comes to wafer-level underfill and encapsulant technology, Henkel’s Hysol brand materials are world-class. Hysol package-level underfill systems are facilitating advances in flip-chip technology, enabling outstanding protection for these delicate devices. All our package-level underfills meet JEDEC testing requirements and the demands of lead-free processing. Further protection is provided with Hysol semiconductor encapsulants, which work together as dam-and-fill materials for bare chip encapsulation. Our high-purity liquid epoxy encapsulants offer protection from mechanical damage and corrosion during the assembly process.

The demands of lead-free processing pose new challenges to the semiconductor industry, as the alloys used for board-level processes are not the most robust for semiconductor applications. Henkel’s advances in solder sphere alloy development have yielded Multicore Accurus lead-free spheres that offer the performance and reliability needed for today’s advanced BGAs and CSPs. With incredibly low oxidation levels, superior solderability, exceptional repeatability and consistent spherical dimensions, Multicore Accurus solder spheres deliver unmatched quality and reliability.

Hysol molding compounds provide the ultimate in component protection and operator ease-of-use.  Designed for use with both auto molds and conventional molds, Henkel’s Hysol molding compounds combine low stress and low moisture absorption with high physical strength. What’s more, Henkel’s unique low warpage formulation affords superior protection without the adverse effects of die warpage that often occurs during the molding process.